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| Category | Specification Details |
|---|---|
| Performance Metrics | Repetitive yield error (same wafer x3): Defect die error < 10 pieces |
| Leakage / Inspection | Leakage rate ≤ 0.5%; Inspection rate ≤ 3% |
| Yield Variance | AOI yield variance between machines < 0.2% |
| 2x Objective Lens | Defect sensitivity ≥ 9.7µm |
| 3.5x Objective Lens | Defect sensitivity ≥ 5µm |
| 5x Objective Lens | Defect sensitivity ≥ 3.5µm |
| 10x Objective Lens | Defect sensitivity ≥ 1.5µm |
| Yield Repeatability | Re-scan error (x3): < ±0.05% |
| Incoming Wafer | 8-inch (200mm diameter) / 12-inch (300mm diameter) |
Established in 2019, primarily engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control procurement for highest cost-effectiveness.
Core Product Range: Die Bonder, Wire Bonding, Laser Marking (ID IC Wafer), Laser Grooving, Laser Cutting, Laser Internal Modification Machine, Laser Annealing Machine, Automatic Dicing Saw Machine, and Automatic Silicone Dispensing Equipment.
